ET 200MP Remote I/O Parts

6ES7590-0BD00-0AA0

Product details

Product Code
6ES7590-0BD00-0AA0
Dimensions
16.4 × 11.1 × 2.7 cm
Weight
0.159 kg
Lifecycle
Active Product
Availability
in stock
Lead Time
Confirmed with quotation
Product Attachment
Download Datasheet

Pricing, condition, availability and delivery terms are confirmed against the exact product reference.

Product information

Overview

Key Features

  • Active backplane bus: Product type designation: Active Backplane ST 1+4 Slot for inserting S7-1500 I/O modules for hot swapping.
  • Slot capacity: Number of slots: 5; up to 1 CPU, 1 IM, 4 PS, 4 IO/CM/CP/TM, or 4 F-IO, subject to the stated configuration conditions.
  • Power consumption: Power consumption from the backplane bus: 2 W. Typical power loss: 2 W.
  • Engineering and communication: STEP 7 TIA Portal is configurable/integrated from V16 / V17; STEP 7 from V5.6 and higher. PROFINET is supported from GSD version/GSD revision V2.35 / -.
  • Installation temperature: Ambient temperature during operation is -30 °C to 60 °C for horizontal installation and -30 °C to 40 °C for vertical installation.
  • Mounting and dimensions: Grid size: 35 mm, with 25 mm-wide modules possible. Dimensions: 154 mm width, 99 mm height, and 14 mm depth.

Technical Summary

Product type Active Backplane ST 1+4 Slot
Product function Active backplane bus for inserting S7-1500 I/O modules for hot swapping
Number of slots 5
Power consumption from the backplane bus 2 W
Grid size 35 mm; Utilization of 25 mm-wide modules possible
PROFINET from GSD version/GSD revision V2.35 / –
Firmware version from V1.0.0
Firmware update possible Yes
Installation altitude above sea level, max. 5 000 m; Restrictions for installation altitudes > 2 000 m, see manual

Frequently Asked Questions

What is the exact product type of Siemens 6ES7590-0BD00-0AA0?

It is an Active Backplane ST 1+4 Slot active backplane bus for inserting S7-1500 I/O modules for hot swapping.

How many slots does the 6ES7590-0BD00-0AA0 have?

It has 5 slots. The stated maximum allocation is 1 CPU, 1 IM, 4 PS, 4 IO/CM/CP/TM, or 4 F-IO, subject to the listed conditions.

What are the installation temperature limits?

During operation, the ambient temperature is -30 °C to 60 °C for horizontal installation and -30 °C to 40 °C for vertical installation.

Which engineering versions are supported?

STEP 7 TIA Portal is configurable/integrated from V16 / V17, and STEP 7 is configurable/integrated from V5.6 and higher. PROFINET is supported from GSD version/GSD revision V2.35 / -.

Can you quote this exact Siemens part for my requirement?

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